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With the development of integrated circuits towards high performance, miniaturization and high integration, three-dimensional packaging technology has become a mainstream trend in the semiconductor industry. 3D packaging achieves a high-density, high-bandwidth, low-power package structure by stacking multiple chips vertically and utilizing vertical interconnects (e.g., TSVs, through-silicon vias). The development of this technology has put forward higher requirements for packaging materials, especially in thermal management, mechanical strength, thermal expansion matching, etc. Molybdenum-Cu alloy is becoming one of the key support materials…

With the development of integrated circuits to high density, miniaturization and high performance, 3D packaging technology has become an important direction in the field of semiconductor packaging. Compared with traditional 2D packaging, 3D packaging greatly improves the integration and computing efficiency of devices through vertical stacking of chips and their interconnection structures. However, the thermal management issues, dimensional stability requirements, and package reliability challenges also place higher performance requirements on the packaging materials. Molybdenum-copper alloy (Mo-Cu) is regarded as an…

Molybdenum-copper alloy is a metal composite material with high thermal conductivity and low coefficient of thermal expansion, which is widely used in electronic packaging, heat sink materials and high-temperature structural parts. However, due to the large physical and chemical differences between molybdenum and copper, there are certain limitations in the mechanical properties of this type of alloy, such as low flexural strength and insufficient fracture toughness. Therefore, how to optimize the mechanical properties of molybdenum and copper has become an…

With the development of electronic devices in the direction of miniaturization, high integration and high power density, the thermal management capability of molybdenum-copper alloys is facing higher technical requirements. How to further optimize its thermal conductivity, thermal diffusivity and thermal stress control performance has become an important topic in current materials research and engineering practice. 1. Optimization of material composition and organizational structure Ingredient design The thermal conductivity and thermal expansion properties of molybdenum copper are highly dependent on its…

As a high-performance electronic packaging material, molybdenum-copper alloy (MoCu) surface treatment technology plays a decisive role in improving the reliability and service life of the package. With the development of the packaging process in the direction of high density, miniaturization and extreme environment adaptation, the surface treatment of this alloy will also show a trend of high precision, multi-function and green environmental protection. 1. The main purpose of surface treatment of MoCu alloy Improve solderability and bondability: The original molybdenum…

With the continuous development of integrated circuit technology, the traditional two-dimensional planar packaging method has been difficult to meet the packaging requirements of high-performance computing, 5G communication, AI chips and other fields for miniaturization, high density, and high heat flux density. As an emerging packaging architecture, 3D packaging technology adopts vertical stacking of chips, multi-chip integration and heterogeneous integration, which not only improves the integration level, but also brings significant thermal management challenges. How to effectively conduct heat, suppress thermal…