
Tungsten copper slab with the properties of tungsten’s high strength, high stiffness, low thermal expansion coefficient and copper’s high plasticity, good electrical and thermal conductivity and other properties. In large scale integrated circuits and high-power microwave devices, tungsten copper alloy material as the substrate, the slug, connectors and cooling components have developed rapidly. More details of tungsten copper plate please visit ?http://www.tungsten-copper.com/tungsten-copper-plate.html However, tungsten copper slab when used as electronic packaging materials, the density must be greater than 98% theoretical…