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Refractory metal tungalloy, which has a series of excellent physical properties, has been widely used in several industries including semiconductor manufacturing industry. Ultrafine tungsten powder and tungsten carbide powder are the main raw materials of high-quality tungsten-base electrical contact alloys, electronic packaging materials, sputtering target materials of refractory gate and barrier layer in integrated circuit, electronic emission materials, etc. The quality of ultrafine tungsten powder and tungsten carbide powder has direct influence on the performance of these tungsten-base electronic materials, thus the manufacturing of high-quality ultrafine tungsten powder and tungsten carbide powder is crucial to semiconductor manufacturing industry.